Tham khảo Rutheni

  1. “Ruthenium: ruthenium(I) fluoride compound data”. OpenMOPAC.net. Truy cập ngày 10 tháng 12 năm 2007. 
  2. Magnetic susceptibility of the elements and inorganic compounds, in Handbook of Chemistry and Physics 81st edition, CRC press.
  3. 1 2 Nature's Building Block, John Emsley, Nhà in Đại học Oxford, 2001
  4. – Giáo sư Anthony Hill – Nghiên cứu hiện tại
  5. Manner W. L.; Girolami G. S.; Nuzzo R. G., Sequential Dehydrogenation of Unsaturated Cyclic C5 and C6 Hydrocarbons on Pt(111). J. Phys. Chem. B 1998, 102, (50), 10295-10306.
  6. Jakob P.; Menzel D., The adsorption of benzene on Ru(001). Surface Science 1988, 210, 503-530.
  7. 1 2 Jakob P. Adsorption und thermische Evolution von aromatischen Molekülen auf Ru(001): Benzol, Benzol+O, CO, H und Pyridin. Doctoral, Technische Universität München, München, 1989.
  8. 1 2 Schneider A.; Popovska N.; Jipa I.; Atakan B.; Siddiqi M. A.; Siddiqui R.; Zenneck U., Minimizing the carbon content of thin ruthenium films by MOCVD precursor complex design and process control. Chemical Vapor Deposition 2007, 13, (8), 389-395.
  9. 1 2 Schneider A.; Popovska N.; Holzmann F.; Gerhard H.; Topf C.; Zenneck U., [(1,5-Cyclooctadiene)(toluene)ruthenium(0)]: A Novel Precursor for the MOCVD of Thin Ruthenium Films. Chemical Vapor Deposition 2005, 11, (2), 99-105.
  10. Schneider A. Metallorganische Chemische Dasphasenabscheidung (MOCVD) von Übergangsmetallen am Beispiel von Eisen, Ruthenium und Wolfram. Doctoral, Universität Erlangen-Nürnberg, Erlangen, 2006.
  11. Green M. L.; Gross M. L.; Papa L. E.; Schnoes K. J.; Brasen D., Chemical Vapor Deposition of Ruthenium and Ruthenium Dioxide Films. Journal of The Electrochemical Society 1985, (132), 2677.
  12. Wang Q.; Ekerdt J. G.; Gay D.; Sun Y.-M.; White J. M., Low-temperature chemical vapor deposition and scaling limit of ultrathin Ru films. Applied Physics Letters 2004, 84, (8), 1380-1382.
  13. Trent D. E.; Paris B.; Krause H. H., Vapor Deposition of Pure Ruthenium Metal from Ruthenocene. Inorg. Chem. 1964, 3, (7), 1057-1058.
  14. Park S. E.; Kim H. M.; Kim K. B.; Min S. H., Metallorganic chemical vapor deposition of Ru and RuO2 using ruthenocene precursor and oxygen gas. Journal of the Electrochemical Society 2000, 147, (1), 203-209.
  15. 1 2 Aoyama T.; Eguchi K., Ruthenium films prepared by liquid source chemical vapor deposition using bis-(ethylcyclopentadienyl)ruthenium. Japanese Journal of Applied Physics 1999, 38, (10A), 1134-6.
  16. Kang S. Y.; Choi K. H.; Lee S. K.; Hwang C. S.; Kim H. J., Thermodynamic Calculations and Metallorganic Chemical Vapor Deposition of Ruthenium Thin Films Using Bis(ethyl-pi-cyclopentadienyl)Ru for Memory Applications. Journal of The Electrochemical Society 2000, 147, (3), 1161-1167.
  17. Matsui Y.; Hiratani M.; Nabatame T.; Shimamoto Y.; Kimura S., Characteristics of Ruthenium Films Prepared by Chemical Vapor Deposition Using Bis(ethylcyclopentadienyl)ruthenium Precursor. Electrochemical and Solid-State Letters 2002, 5, (1), C18-C21.
  18. Nabatame T.; Hiratani M.; Kadoshima M.; Shimamoto Y.; Matsui Y.; Ohji Y.; Asano I.; Fujiwara T.; Suzuki T., Properties of ruthenium films prepared by liquid source metalorganic chemical vapor deposition using Ru(EtCp)2 with tetrahydrofuran solvent. Japanese Journal of Applied Physics 2000, 39, (11B), 1188-90.
  19. Kadoshima M.; Nabatame T.; Hiratani M.; Nakamura Y.; Asano I.; Suzuki T., Ruthenium Films Prepared by Liquid Source Metalorganic Chemical Vapor Deposition Using Ru(dpm)3 Dissolved with Tetrahydrofuran Solvent. Japanese Journal of Applied Physics 2002, 41 Phần 2, (3B), L347-L350.
  20. Lai Y.-H.; Chen Y.-L.; Chi Y.; Liu C.-S.; Carty A. J.; Peng S.-M.; Lee G.-H., Deposition of Ru and RuO2 thin films employing dicarbonyl bis-diketonate ruthenium complexes as CVD source reagents. Journal of Materials Chemistry 2003, 13, 1999-2006.
  21. Lee J.-H.; Kim J.-Y.; Rhee S.-W.; Yang D.; Kim D.-H.; Yang C.-H.; Han Y.-K.; Hwang C.-J., Chemical vapor deposition of Ru thin films by direct liquid injection of Ru(OD)3 (OD=octanedionate). Journal of Vacuum Science & Technology A 2000, 18, (5), 2400-2403.
  22. Kang S. Y.; Lim H. J.; Hwang C. S.; Kim H. J., Metallorganic chemical vapor deposition of Ru films using cyclopentadienyl-propylcyclopentadienylruthenium(II) and oxygen. Journal of the Electrochemical Society 2002, 149, (6), C317-C323.
  23. Choi J.; Choi Y.; Hong J.; Tian H.; Roh J.-S.; Kim Y.; Chung T.-M.; Woo Oh Y.; Kim Y.; Kim C. G.; No K., Composition and Electrical Properties of Metallic Ru Thin Films Deposited Using Ru(C6H6)(C6H8) Precursor. Japanese Journal of Applied Physics 2002, 41, (11B), 6852-6856.
  24. It's Elemental - Ruthenium
  25. Richards A.D. & Rodger A. (2007). Synthetic metallomolecules as agents for the control of DNA structure Chem. Soc. Rev. 36 471-483.
  26. Wei P.; Desu S. B., Reactive ion etching of RuO2 films: the role of additive gases in O2 discharge. Physica Status Solidi A 1997, 161, (1), 201-15.
  27. Lesaicherre P. Y.; Yamamichi S.; Takemura K.; Yamaguchi H.; Tokashiki K.; Miyasaka Y.; Yoshida M.; Ono H., A Gbit-scale DRAM stacked capacitor with ECR MOCVD SrTiO3 over RIE patterned RuO2/TiN storage nodes. Integrated Ferroelectrics 1995, 11, (1-4), 81-100.
  28. Pan W.; Desu S. B., Reactive Ion Etching of RuO2, Thin-Films Using the Gas-Mixture O2 Cf3cfh2. Journal of Vacuum Science & Technology B 1994, 12, (6), 3208-3213.
  29. Vijay D. P.; Desu S. B.; Pan W., Reactive Ion Etching of Lead-Zirconate-Titanate (PZT) Thin-Film Capacitors. Journal of the Electrochemical Society 1993, 140, (9), 2635-2639.
  30. Saito S.; Kuramasu K., Plasma etching of RuO2 thin films. Japanese Journal of Applied Physics 1992, 31, (1), 135-8.
  31. Iizuka T.; Arita K.; Yamamoto I.; Yamamichi S., (Ba,Sr)TiO3 thin film capacitors with Ru electrodes for application to ULSI processes. NEC Research and Development 2001, 42, (1), 64-9.
  32. Yamamichi S.; Lesaicherre P. Y.; Yamaguchi H.; Takemura K.; Sone S.; Yabuta H.; Sato K.; Tamura T.; Nakajima K.; Ohnishi S.; Tokashiki K.; Hayashi Y.; Kato Y.; Miyasaka Y.; Yoshida M.; Ono H., A stacked capacitor technology with ECR plasma MOCVD (Ba,Sr)TiO3 and RuO2/Ru/TiN/TiSix storage nodes for Gb-scale DRAM's. IEEE Transactions on Electron Devices 1997, 44, (7), 1076-1083.
  33. Bandaru J.; Sands T.; Tsakalakos L., Simple Ru electrode scheme for ferroelectric (Pb,La)(Zr,Ti)O3 capacitors directly on silicon. Journal of Applied Physics 1998, 84, (2), 1121-1125.
  34. Maiwa H.; Ichinose N.; Okazaki K., Preparation and properties of Ru and RuO2 thin film electrodes for ferroelectric thin films. Jpn. J. Appl. Phys. 1994, 33, (9B), 5223-6.
  35. Misra V.; Lucovsky G.; Parsons G., Issues in high-kappa gate stack interfaces. MRS Bulletin 2002, 27, (3), 212-216.
  36. Chan R.; Arunagiri T. N.; Zhang Y.; Chyan O.; Wallace R. M.; Kim M. J.; Hurd T. Q., Diffusion Studies of Copper on Ruthenium Thin Film. Electrochemical and Solid-State Letters 2004, 7, (8), G154-G157.
  37. Cho S. K.; Kim S.-K.; Kim J. J.; Oh S. M., Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier. Journal of Vacuum Science and Technology B 2004, 22, (6), 2649-2653.
  38. Chyan O.; Arunagiri T. N.; Ponnuswamy T., Electrodeposition of Copper Thin Film on Ruthenium. Journal of The Electrochemical Society 2003, 150, (5), C347-C350.
  39. Kwon O.-K.; Kwon S.-H.; Park H.-S.; Kang S.-W., PEALD of a Ruthenium Adhesion Layer for Copper Interconnects. Journal of The Electrochemical Society 2004, 151, (12), C753-C756.
  40. Kwon O.-K.; Kim J.-H.; Park H.-S.; Kang S.-W., Atomic Layer Deposition of Ruthenium Thin Films for Copper Glue Layer. Journal of The Electrochemical Society 2004, 151, (2), G109-G112.
  41. Moffat T. P.; Walker M.; Chen P. J.; Bonevich J. E.; Egelhoff W. F.; Richter L.; Witt C.; Aaltonen T.; Ritala M.; Leskelä M.; Josella D., Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing. Journal of The Electrochemical Society 2006, 153, (1), C37-C50.
  42. Brian Hayes, Terabyte Territory, American Scientist, quyển 90 số 3 (tháng 5/6-2002) trang 212
  43. Ruthenium Tetroxide and Other Ruthenium Compounds?
  44. inhalation of radionuclides and carcinogenesis

Tài liệu tham khảo

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